Input Impedance Modeling of Three-Level Multi-Stage NPC Topology

Publikation: Beitrag in Buch oder Tagungsband › Vortrag mit Beitrag in Tagungsband › Begutachtung

Originalsprache	Englisch
Titel	2018 IEEE Transportation and Electrification Conference and Expo (ITEC)
Seiten	372-379
Seitenumfang	8
Publikationsstatus	Veröffentlicht - 2018
Veranstaltung	IEEE Transportation and Electrification Conference and Expo (ITEC) - Dauer: 12 Juni 2018 → 15 Juni 2018

Konferenz	IEEE Transportation and Electrification Conference and Expo (ITEC)
Zeitraum	12/06/18 → 15/06/18

Research Field

@inproceedings{064cac1ff75140088f53f156fa30166c,

title = "Input Impedance Modeling of Three-Level Multi-Stage NPC Topology",

author = "Makoschitz, {Markus Leopold} and Johannes St{\"o}ckl and Wolfgang Hribernik",

year = "2018",

language = "English",

isbn = "978-1-5386-3047-1",

pages = "372--379",

booktitle = "2018 IEEE Transportation and Electrification Conference and Expo (ITEC)",

note = "IEEE Transportation and Electrification Conference and Expo (ITEC) ; Conference date: 12-06-2018 Through 15-06-2018",

}

TY - GEN

T1 - Input Impedance Modeling of Three-Level Multi-Stage NPC Topology

AU - Stöckl, Johannes

AU - Hribernik, Wolfgang

A2 - Makoschitz, Markus Leopold

PY - 2018

Y1 - 2018

M3 - Conference Proceedings with Oral Presentation

SN - 978-1-5386-3047-1

SP - 372

EP - 379

BT - 2018 IEEE Transportation and Electrification Conference and Expo (ITEC)

T2 - IEEE Transportation and Electrification Conference and Expo (ITEC)

Y2 - 12 June 2018 through 15 June 2018

ER -