Interconnected heat pumps in Austria: A technology implementation survey

Publikation: Beitrag in Buch oder TagungsbandVortrag mit Beitrag in TagungsbandBegutachtung

Abstract

Heat pumps become increasingly connected devices enabled to participate in the Internet of Things (IoT). Such heat pumps, both in domestic and industrial applications, allow for operation optimization to reduce energy consumption, to reduce the carbon footprint, to realize economic benefits or to increase comfort. They also enable grid services, which is of increasing importance due to the rising share of renewable energy. This contribution presents results of a survey among companies of the Austrian heat pump industry which was conducted to gather and evaluate the general sentiment on the relevance of interconnected heat pumps, state-of-the-art use cases, market availability and selected technology trends. The collected feedback clearly indicates significant progress in technology implementation. All participating companies offer both, IoT products (e.g. heat pumps with connectivity or intelligent components such as compressors or sensors), and related services (e.g. marketing of flexibility, remote service, monitoring, etc.). While two thirds of these products are already available either in the product portfolio of the companies, or in a large number in use, another third is currently under evaluation, under development or in a pilot phase. IoT technology is expected to bring significant changes in product development, business models and maintenance. For IoT enabled heat pumps this means that instead of being an autonomous smart component, they will be increasingly integrated and will be part of connected energy systems in the future.
OriginalspracheEnglisch
TitelProceedings of the 14th IEA Heat Pump Conference
Seitenumfang7
PublikationsstatusVeröffentlicht - 18 Mai 2023
Veranstaltung14th IEA Heat Pump Conference - Chicago, USA/Vereinigte Staaten
Dauer: 15 Mai 202318 Mai 2023
https://www.hpc2023.org/

Konferenz

Konferenz14th IEA Heat Pump Conference
Land/GebietUSA/Vereinigte Staaten
StadtChicago
Zeitraum15/05/2318/05/23
Internetadresse

Research Field

  • Efficiency in Industrial Processes and Systems

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