Properties and Microstructure of Short Carbon Fibre Reinforced Coper-Matrix Composites

Georg Korb, Walter Buchgraber , Thomas Schubert

    Publikation: Beitrag in Buch oder TagungsbandVortrag mit Beitrag in TagungsbandBegutachtung

    Abstract

    Carbon fibre reinforced copper matrix composites possess properties of copper, i.e., excellent thermal and electrical conductivities, but the properties of carbon fibre, i.e., a small thermal expansion coefficient dominate the mechanical behaviour. Since the desirable properties of the composite can be obtained by selecting the amount and type of the carbon fibres, it is considered to be suitable for use as electric and electronic materials like special heat sinks. It is a competitive material which is able to overcome some of the disadvantages of e.g. Copper-Molybdenum, Copper-Invar or Aluminium-Silicon Carbide. Copper matrix composites with high conducting endless carbon fibres have been investigated in different research groups for several years, but copper matrix composites with high conducting short fibres are a new and promising field of research. Composites have been made by hot-pressing of copper coated carbon fibres. Due to a special production route - electroless copper coating - a good distribution of the fibres in the matrix and a good interfacial contact is obtained. Measured properties, i.e., thermal conductivity and coefficient of thermal expansion have been compared with microstructural results and results obtained from models. Up to now these composites provide a thermal conductivity of about 250-300 W/mK in two dimensions and about 140 W/mK in the third dimension. The coefficient of thermal expansion (CTE) can be tailored in a range of 4-10 ppm/K. The low density of about 4-6 g/cm3 is of importance wherever weight reduction is desired. The results are compared with composites produced by powder metallurgical route and composites made with low conducting short carbon fibres respectively.
    OriginalspracheEnglisch
    Titel21st International Spring Seminar on Electronics Technology (ISSE'98)
    Herausgeber (Verlag)Vienna University of Technology
    Seiten116-120
    Seitenumfang5
    ISBN (Print)3-85465-004-3
    PublikationsstatusVeröffentlicht - 1998
    Veranstaltung21st International Spring Seminar on Electronics Technology (ISSE'98) -
    Dauer: 1 Jan. 1998 → …

    Konferenz

    Konferenz21st International Spring Seminar on Electronics Technology (ISSE'98)
    Zeitraum1/01/98 → …

    Research Field

    • Nicht definiert

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