17th International Conference on Tangible Embedded and Embodied Interaction (TEI 2023) (Event)

    Activity: Editorial and Review Activities › Participation in Conference Committees

    Description

    Associate Chair at WIP Track
    Period2023
    Event typeConference
    LocationWarsaw, PolandShow on map
    Degree of RecognitionInternational

    Research Field

    • Former Research Field - Experience Business Transformation