Analyzing Thermal Conductivity of Polyethylene-Based Compounds Filled with Copper

Helena Weingrill, Wolfgang Hohenauer, Katharina Resch-Fauster, Christoph Zauner

Research output: Contribution to journalArticlepeer-review


The thermal conductivity (TC) of different polymeric materials is measured via four commercially available testing devices: TPS2500S by Hot Disk (Hot Disk), Transient Hot Bridge (THB) by Linseis, the Laser Flash Analysis (LFA) by NETZSCH, and the DTC‐300 by TA Instruments. The investigated materials include high‐density polyethylene (HDPE) and linear low‐density polyethylene (LLDPE) which are analyzed as received and after being compounded with copper particles. The filler geometry and ratio are varied systematically. Major differences in the TC generated by the different measurement methods are revealed and analyzed in detail. Moreover, material‐induced impacts on the TC as well as technology‐induced impacts on the TC are outlined comprehensively.
Original languageEnglish
Number of pages14
JournalMacromolecular Materials and Engineering
Publication statusPublished - 2019

Research Field

  • Efficiency in Industrial Processes and Systems


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