Effects on microstructure and mechanical properties of the addition of Co, Cr and Fe to the eutectoid system Ti-6.5Cu

Ella Staufer (Speaker), Christian Edtmaier, Elisabeth Ballok, Nico Moser, Tobias Bauernfeind, Thomas Klein, Duyao Zhang, Mark Easton, Dong Qiu, Martin Schmitz-Niederau, Lena Trunova, Jelena Horky

Research output: Poster presentation without proceedingspeer-review

Abstract

Wire-based additive manufacturing has increased in popularity for the fabrication of large titanium components. However,
only a few wire materials (pure titanium and Ti-6Al-4V) are commercially available, and these are prone to columnar grain
growth and, thus, anisotropic mechanical properties. Therefore, the primary objective was to develop titanium alloy wires
with isotropic properties, high specific strength, and sufficiently high ductility after WAAM processing. Adding a eutectoid-
forming alloying element like Cu or Ni can suppress the formation of columnar grains. Ti-6.5Cu-based alloys with Co, Cr
and Fe additions in concentrations between 0.5 wt.% and 3 wt.% were first evaluated by CALPHAD methods and then
experimentally prepared by inductive melting. Additionally, larger samples were produced by hot powder extrusion. The
microstructural evolution was investigated by optical microscopy, scanning electron microscopy and X-ray diffraction.
Further, the microhardness and tensile strength on selected samples were determined. Adding all elements leads to a
martensitic microstructure, which refines upon the increasing amount of alloying elements. Furthermore, the addition of
alloying elements leads to a reduction in the size of the prior β-grains and to equiaxial grain growth. In addition, an increase
in mechanical properties was observed
Original languageEnglish
Publication statusPublished - 31 Mar 2023
Event23. Werkstofftechnisches Kolloquium in Chemnitz - Chemnitz, Chemnitz, Germany
Duration: 29 Mar 202330 Mar 2023

Conference

Conference23. Werkstofftechnisches Kolloquium in Chemnitz
Country/TerritoryGermany
CityChemnitz
Period29/03/2330/03/23

Research Field

  • Wire-Based Additive Manufacturing

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